Special Section on the Application of Fracture Mechanics in Electronic PackagingSource: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004::page 321Author:David T. Read
DOI: 10.1115/1.2792640Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Fracture mechanics AND Electronic packaging ,
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| contributor author | David T. Read | |
| date accessioned | 2017-05-08T23:56:12Z | |
| date available | 2017-05-08T23:56:12Z | |
| date copyright | December, 1998 | |
| date issued | 1998 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26169#321_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120226 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Special Section on the Application of Fracture Mechanics in Electronic Packaging | |
| type | Journal Paper | |
| journal volume | 120 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792640 | |
| journal fristpage | 321 | |
| identifier eissn | 1043-7398 | |
| keywords | Fracture mechanics AND Electronic packaging | |
| tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004 | |
| contenttype | Fulltext |