YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Uniform Channel Micro Heat Exchangers

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002::page 89
    Author:
    X. Yin
    ,
    H. H. Bau
    DOI: 10.1115/1.2792225
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The performance characteristics of micro heat exchangers consisting of straight channels fabricated in a silicon wafer and operating with liquid nitrogen are evaluated theoretically. The three-dimensional conjugate temperature and flow fields are calculated numerically. The thermal resistance is computed as a function of various geometric parameters. The optimal dimensions which minimize the heat exchanger’s thermal resistance are identified. Additionally, a simple, approximate, analytical model, adequate when the ratio of the solid and liquid thermal conductivities is large, is presented and used to predict the heat exchanger’s optimal dimensions. The approximate model’s predictions are compared with the numerical results.
    keyword(s): Channels (Hydraulic engineering) AND Heat exchangers ,
    • Download: (573.6Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Statistics

      Uniform Channel Micro Heat Exchangers

    URI
    https://yetl.yabesh.ir/yetl1/handle/yetl/118537
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorX. Yin
    contributor authorH. H. Bau
    date accessioned2017-05-08T23:53:13Z
    date available2017-05-08T23:53:13Z
    date copyrightJune, 1997
    date issued1997
    identifier issn1528-9044
    identifier otherJEPAE4-26160#89_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/118537
    description abstractThe performance characteristics of micro heat exchangers consisting of straight channels fabricated in a silicon wafer and operating with liquid nitrogen are evaluated theoretically. The three-dimensional conjugate temperature and flow fields are calculated numerically. The thermal resistance is computed as a function of various geometric parameters. The optimal dimensions which minimize the heat exchanger’s thermal resistance are identified. Additionally, a simple, approximate, analytical model, adequate when the ratio of the solid and liquid thermal conductivities is large, is presented and used to predict the heat exchanger’s optimal dimensions. The approximate model’s predictions are compared with the numerical results.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleUniform Channel Micro Heat Exchangers
    typeJournal Paper
    journal volume119
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792225
    journal fristpage89
    journal lastpage94
    identifier eissn1043-7398
    keywordsChannels (Hydraulic engineering) AND Heat exchangers
    treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 002
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian