Impact of Tapering on Interfacial StressesSource: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003::page 184Author:Boris Mirman
DOI: 10.1115/1.2792150Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reduction of interfacial thermal stresses is estimated for a bimaterial strip tapered at the edges. Simple equations for this stress reduction are proposed.
keyword(s): Stress , Thermal stresses , Stress , Equations AND Strips ,
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| contributor author | Boris Mirman | |
| date accessioned | 2017-05-08T23:49:48Z | |
| date available | 2017-05-08T23:49:48Z | |
| date copyright | September, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26155#184_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116770 | |
| description abstract | The reduction of interfacial thermal stresses is estimated for a bimaterial strip tapered at the edges. Simple equations for this stress reduction are proposed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Impact of Tapering on Interfacial Stresses | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792150 | |
| journal fristpage | 184 | |
| journal lastpage | 187 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress | |
| keywords | Thermal stresses | |
| keywords | Stress | |
| keywords | Equations AND Strips | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003 | |
| contenttype | Fulltext |