| contributor author | Yi-Hsiang Huang | |
| contributor author | Suresh K. Aggarwal | |
| date accessioned | 2017-05-08T23:46:52Z | |
| date available | 2017-05-08T23:46:52Z | |
| date copyright | December, 1995 | |
| date issued | 1995 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26151#301_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115130 | |
| description abstract | This study presents a numerical investigation of the effects of wall conduction on laminar natural convection heat transfer in a two-dimensional rectangular enclosure. The heat transfer is driven by a constant-temperature heat source in the center of the enclosure. The time dependent governing equations in the primitive form are solved numerically by the use of a finite-volume method. The numerical algorithm is first validated by comparing our predictions with those of Kim and Viskanta for a square cavity surrounded by four conducting walls. A parametric study is then conducted to examine the effects of wall conduction on the natural convection heat transfer. The parameters include the Rayleigh number, wall thickness, wall thermal conductivity ratio and diffusivity ratio. In addition, the effects of varying thermal boundary conditions on the outside walls are reported. Results indicate that the qualitative features of natural convection heat transfer in the laminar range are not significantly altered by the inclusion of wall conduction. However, the quantitative results may be significantly modified by the wall conductance. In general, the wall conduction reduces the rate of heat dissipation from the enclosure. The average Nusselt number decreases as the wall thickness ratio is increased and/or the wall thermal conductivity is reduced. Results also indicate that it may be possible to define an effective Rayleigh number that includes the effects of wall thickness and conductivity. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Wall Conduction on Natural Convection in an Enclosure With a Centered Heat Source | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792109 | |
| journal fristpage | 301 | |
| journal lastpage | 306 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat | |
| keywords | Heat conduction | |
| keywords | Natural convection | |
| keywords | Heat transfer | |
| keywords | Wall thickness | |
| keywords | Rayleigh number | |
| keywords | Thermal conductivity | |
| keywords | Electrical conductance | |
| keywords | Algorithms | |
| keywords | Exterior walls | |
| keywords | Energy dissipation | |
| keywords | Temperature | |
| keywords | Boundary-value problems | |
| keywords | Cavities | |
| keywords | Conductivity | |
| keywords | Equations AND Finite volume methods | |
| tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004 | |
| contenttype | Fulltext | |