Translation of Stress States Into Reliability Terms for Single Chip Ceramic PackagesSource: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004::page 258Author:Boris Mirman
DOI: 10.1115/1.2905696Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper addresses the gap between optimistic and pessimistic analytical predictions of the reliability of microelectronic structures using the example of single chip ceramic packages. The necessity of structural (rather than material) characterization is emphasized. Equations for the probability of failure of a single chip ceramic package are presented.
keyword(s): Ceramics , Reliability , Stress , Equations , Failure AND Probability ,
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| contributor author | Boris Mirman | |
| date accessioned | 2017-05-08T23:43:53Z | |
| date available | 2017-05-08T23:43:53Z | |
| date copyright | December, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26146#258_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113413 | |
| description abstract | This paper addresses the gap between optimistic and pessimistic analytical predictions of the reliability of microelectronic structures using the example of single chip ceramic packages. The necessity of structural (rather than material) characterization is emphasized. Equations for the probability of failure of a single chip ceramic package are presented. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Translation of Stress States Into Reliability Terms for Single Chip Ceramic Packages | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905696 | |
| journal fristpage | 258 | |
| journal lastpage | 264 | |
| identifier eissn | 1043-7398 | |
| keywords | Ceramics | |
| keywords | Reliability | |
| keywords | Stress | |
| keywords | Equations | |
| keywords | Failure AND Probability | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004 | |
| contenttype | Fulltext |