A Simplified Thermal Analysis and Design Methodology for Printed Circuit BoardsSource: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003::page 339Author:A. Hadim
DOI: 10.1115/1.2909338Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental technique. In order to demonstrate its capabilities, this methodology is implemented to correlate natural convection on a printed circuit board oriented horizontally inside an enclosure. The empirical constants used in the correlation were determined through a numerical algorithm in which the sum of the squared error between calculated temperatures and experimental measurements is minimized using the downhill simplex algorithm.
keyword(s): Design methodology , Thermal analysis , Printed circuit boards , Algorithms , Design , Temperature , Measurement , Computer-aided engineering , Modeling , Natural convection , Errors AND Networks ,
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| contributor author | A. Hadim | |
| date accessioned | 2017-05-08T23:41:01Z | |
| date available | 2017-05-08T23:41:01Z | |
| date copyright | September, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26139#339_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111767 | |
| description abstract | A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental technique. In order to demonstrate its capabilities, this methodology is implemented to correlate natural convection on a printed circuit board oriented horizontally inside an enclosure. The empirical constants used in the correlation were determined through a numerical algorithm in which the sum of the squared error between calculated temperatures and experimental measurements is minimized using the downhill simplex algorithm. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909338 | |
| journal fristpage | 339 | |
| journal lastpage | 342 | |
| identifier eissn | 1043-7398 | |
| keywords | Design methodology | |
| keywords | Thermal analysis | |
| keywords | Printed circuit boards | |
| keywords | Algorithms | |
| keywords | Design | |
| keywords | Temperature | |
| keywords | Measurement | |
| keywords | Computer-aided engineering | |
| keywords | Modeling | |
| keywords | Natural convection | |
| keywords | Errors AND Networks | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 003 | |
| contenttype | Fulltext |