Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and DiscussionSource: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004::page 317DOI: 10.1115/1.2904384Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Modeling ,
|
Collections
Show full item record
| contributor author | F. Erdogan | |
| contributor author | P. F. Joseph | |
| date accessioned | 2017-05-08T23:32:20Z | |
| date available | 2017-05-08T23:32:20Z | |
| date copyright | December, 1990 | |
| date issued | 1990 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26119#317_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106744 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and Discussion | |
| type | Journal Paper | |
| journal volume | 112 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2904384 | |
| journal fristpage | 317 | |
| journal lastpage | 326 | |
| identifier eissn | 1043-7398 | |
| keywords | Modeling | |
| tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004 | |
| contenttype | Fulltext |