Abstract: Testing the thermal properties of thermal interface material (TIM) has been a big challenge for decades. Recent development trends made this challenge even bigger, as now the values that have ...

Abstract: The thermal behavior of a microcooler has been investigated using two different measurement methods to verify their feasibility. On the one hand structure function derived from the thermal ...

Abstract: Nowadays, thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test ...