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    Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004:;page 44501
    Author(s): Zhu, Zhiyuan; Yu, Min; Liu, Lisha; Jin, Yufeng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper researches temporary bonding/debonding based on propylene carbonate (PPC). The highest shear strength of 4.1 MPa was achieved when pure PPC was used as bonding adhesive. Room temperature debonding methods were ...
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