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RISThermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A bare, four copper layer printed wiring board with simple trace patterns was built for modeling and experimental validation purposes. In-plane elastic properties of the core materials in the ...
A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A finite element procedure using a semi-implicit time-integration scheme has been developed for a cyclic thermoviscoplastic constitutive model for Pb-Sn solder and OFHC copper, two common metallic ...