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    High Thermal Conductive Si3N4 Particle Filled Epoxy Composites With a Novel Structure 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004:;page 469
    Author(s): Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that ...
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