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    Special Section on the Application of Fracture Mechanics in Electronic Packaging 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004:;page 321
    Author(s): David T. Read
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses 

    Source: Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001:;page 1
    Author(s): David T. Read; James W. Dally
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Fatigue life as a function of number of stress cycles has been determined for three-layer titanium-aluminum-titanium thin-film specimens. For nominal stresses ranging from 50 to 90 percent of ...
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