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RISInhibiting Intermetallic Compound Growth at the Cu/Sn Interface Through the Electrochemical Deposition of Multiwalled Carbon Nanotubes on Cu
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. This paper presents a method to enhance the reliability of Cu/Sn interfaces in semiconductor devices by inhibiting the formation of intermetallic compounds (IMCs). We explored the electrochemical deposition of ...