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    Digital Photothermoelastic and Numerical Analysis of Transient Thermal Stresses in Cracked Bimaterial Interfaces 

    Source: Journal of Applied Mechanics:;2009:;volume( 076 ):;issue: 004:;page 44502
    Author(s): B. Neethi Simon; K. Ramesh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Transient thermal stresses of a bimaterial specimen with interface cracks, under uniform cooling by convection, are analyzed by photothermoelasticity and a coupled temperature-displacement, finite ...
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