• Login
    View Item 
    •   DSpace Home
    • ASCE
    • Journal of Architectural Engineering
    • View Item
    •   DSpace Home
    • ASCE
    • Journal of Architectural Engineering
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Variations of Thermal Conductivity of Insulation Materials Under Different Operating Temperatures: Impact on Envelope-Induced Cooling Load

    Thumbnail
    View/Open
    %28asce%291076-0431%282002%298%3A4%28125%29.pdf (249.5Kb)
    Date
    2002
    Author
    I. Budaiwi
    A. Abdou
    M. Al-Homoud
    Metadata
    Show full item record
    Abstract
    The thermal and energy performance of buildings depends on the thermal characteristics of the building envelope, and particularly on the thermal resistance of the insulation material used. The performance of the thermal insulation material is mainly determined by its thermal conductivity, which describes the ability of heat to flow across the material in the presence of a differential temperature. The value of the thermal conductivity of a particular material is subject to variation, due to changes in both moisture content and temperature. In reality, thermal insulation in buildings is exposed to significant and continuous temperature variations, due to varying outdoor air temperature and solar radiation. However, when calculating cooling loads or performing energy analyses for buildings, most designers, if not all, use published or manufacturer-supplied values of thermal conductivity, which are normally evaluated at
    URI
    http://yetl.yabesh.ir/yetl/handle/yetl/48654
    Collections
    • Journal of Architectural Engineering

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV
     

     

    Browse

    All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister

    Statistics

    View Usage Statistics

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV