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dc.contributor.authorHeinrich, Lauren
dc.contributor.authorHoffmann, Miguel
dc.contributor.authorHerberger, Callan
dc.contributor.authorKannan, Rangasayee
dc.contributor.authorNandwana, Peeyush
dc.contributor.authorFillingim, Kenton B.
dc.contributor.authorSaldaña, Christopher
dc.contributor.authorFeldhausen, Thomas
dc.date.accessioned2026-08-23T08:41:57Z
dc.date.available2026-08-23T08:41:57Z
dc.date.copyright2026/06/01
dc.date.issued2026
dc.identifier.issn1087-1357
dc.identifier.othermanu-25-1447.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4316914
dc.description.abstractAbstract. This study investigates the additive manufacturing (AM) processing, microstructural evolution, and resulting mechanical and thermal properties of multimaterial components combining 17-4PH stainless steel and pure copper (Cu) fabricated via laser powder directed energy deposition (LP-DED). Conventional tooling steels exhibit limited thermal conductivity, significantly constraining production throughput in high-volume processes. Incorporating Cu, with its superior thermal conductivity, could significantly enhance tool performance, though Cu and steel present metallurgical incompatibilities when processed via AM. A systematic investigation was conducted across compositions ranging from 0 to 100 wt% Cu, revealing critical thresholds influencing solidification behavior, defect formation, microstructure, hardness, and thermal transport. Optical microscopy, electron backscatter diffraction (EBSD), hardness testing, and thermal conductivity measurements provided comprehensive process–structure–property correlations. Severe hot cracking occurred at low-Cu contents (6–25 wt%), aligning generally well with crack susceptibility modeling, with an unexpected discrepancy at 25 wt%. Porosity remained low (≥99% dense) throughout the compositional spectrum. EBSD analysis revealed a transformation from columnar martensitic structures at low-Cu contents to equiaxed FCC Cu-dominated structures at higher Cu concentrations, highlighting the complex microstructural transitions driven by Cu-induced changes in solidification and phase stability. Hardness decreased from 330 HV (pure 17-4PH) to 62 HV (pure Cu), consistent with microstructural changes. Concurrently, thermal conductivity improved substantially from 13.5 W/m K to 367.9 W/m K, emphasizing Cu’s dominant role in thermal transport. The findings highlight the feasibility of leveraging compositional gradients between 17-4PH and Cu to achieve tailored tooling with optimized thermal and mechanical performance.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleTailoring Thermal and Mechanical Performance Through Multimaterial Laser Powder Directed Energy Deposition of Copper and 17-4PH Stainless Steel
dc.typeJournal Paper
dc.journal.volume148
dc.journal.issue6
dc.journal.titleJournal of Manufacturing Science and Engineering
dc.identifier.doi10.1115/1.4071401
dc.treeJournal of Manufacturing Science and Engineering:;2026:;volume( 148 ):;issue:006
dc.contenttypeFulltext


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