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dc.contributor.authorZhang, Bin
dc.contributor.authorZhang, Hongliang
dc.contributor.authorZhao, Zi'ang
dc.contributor.authorLiu, Qiang
dc.contributor.authorZeng, Fanpeng
dc.contributor.authorCui, Yingxin
dc.contributor.authorXu, Mingsheng
dc.contributor.authorXu, Xiangang
dc.contributor.authorLinewih, Handoko
dc.contributor.authorHan, Jisheng
dc.contributor.authorZhong, Yu
dc.date.accessioned2026-08-23T08:19:11Z
dc.date.available2026-08-23T08:19:11Z
dc.date.copyright2026/09/01
dc.date.issued2026
dc.identifier.issn1043-7398
dc.identifier.otherep-24-1098.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4316380
dc.description.abstractAbstract. The surge current capability is one of the important key parameters for the application of silicon carbide (SiC) Schottky barrier diode (SBD) in power converters. A comparison is conducted between the surge current capability of single-chip packaged SiC SBD and dual-chip packaged SiC SBD. The result indicates that the dual-chip SBD with the same power has a higher nonrepetitive surge current limit. This article also focuses on the prediction of nonrepetitive surge current limits for dual-chip packaged SiC SBDs using an electrothermal model. The simulation and the actual device test results are matching well within 2.8% margin. Thus, it represents this simulation model that can be applied to predict the surge current capacity of the dual-chip packaged SiC SBD.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleSurge Current Capability of Dual-Chip Packaged SiC Schottky Barrier Diodes
dc.typeJournal Paper
dc.journal.volume148
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4070687
dc.journal.fristpage267
dc.journal.lastpage270
dc.page4
dc.treeJournal of Electronic Packaging:;2026:;volume( 148 ):;issue:003
dc.contenttypeFulltext


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