Impact of Dielectrophoretic Vapor Extraction Force on Electronics Performance

Abstract

Abstract. Modern electronic systems are advancing rapidly, driving devices to operate at higher power levels within increasingly compact and challenging environments. This trend elevates the need for more capable thermal management solutions. As modern central processing units (CPUs) generate substantial heat to meet performance requirements, submerge cooling can be effective. However, this methodology depends on efficient bubble extraction, especially in the absence of gravity with boiling, where the buoyancy force is absent. Developing a thermal management system that addresses these constraints while enhancing the thermal and computational performance for computers is needed. Electrohydrodynamics (EHD) is a nonmechanical method that can be integrated into various configurations and programmable scenarios for effective thermal management techniques from micro- to macroscale in space and terrestrial conditions. Dielectrophoresis (DEP) offers a mechanism for phase-change separation of liquid and vapor for heat transfer enhancement. However, the effect of this mechanism has not been examined on electronic devices' performance previously. This study addresses the performance of electronic cooling with the aid of the DEP mechanism. This is illustrated with the use of a Raspberry Pi 5 by cooling the CPU surface in three orientations. Results show that the use of DEP for vapor extraction successfully decreases the CPU surface temperature, as well as maintains, and in some cases improves, the performance and functionality of the Raspberry Pi 5. These findings suggest that DEP can be integrated into thermal management systems to ensure that electronic devices remain at operable temperatures with reliable computation performance.