• Login
    View Item 
    •   DSpace Home
    • ASME
    • Journal of Thermal Science and Engineering Applications
    • View Item
    •   DSpace Home
    • ASME
    • Journal of Thermal Science and Engineering Applications
    • View Item
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Study on the Thermal Comfort in Office Buildings Adopting Low-Velocity Air Circulation and Displacement Ventilation Systems

    Thumbnail
    View/Open
    tsea-25-1302.pdf (1.654Mb)
    Date
    2026
    Author
    Li, Zhao
    Shen, Junbo
    Chen, Jianbo
    Bu, Yixiao
    Xia, Wenxin
    Metadata
    Show full item record
    Abstract
    Abstract. With the improvement of living standards, the demand for indoor comfort has increased. Fan coil systems have been found to cause uneven indoor temperature distribution, strong drafts, airflow short-circuiting, stagnant zones, and high noise levels during long-term use, thereby failing to ensure thermal comfort for occupants. This study investigates airflow characteristics and thermal comfort under low-velocity indoor air circulation. By adjusting fan coil and dehumidified displacement ventilation parameters, a more comfortable and healthier environment is achieved. The research focuses on a typical office fan coil unit with fresh air system. Environmental parameters were measured and recorded on an experimental platform in summer and winter to analyze the impact of different fan coil air parameters on indoor airflow and thermal comfort. The study shows that under low-velocity air circulation, short air jets cause temperature differences in the working area. However, the building envelope's insulation, airflow kinetics, and temperature field diffusion maintain stable indoor airflow and acceptable temperature uniformity. Compared to traditional systems, low-velocity systems reduce maximum air velocity by 62% in winter and 20% in summer, with a draft dissatisfaction coefficient of only 28–61%. For long-term seated occupants, optimal temperature settings and well-insulated envelopes are required.
    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4315396
    Collections
    • Journal of Thermal Science and Engineering Applications

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV
     

     

    Browse

    All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

    My Account

    LoginRegister

    Statistics

    View Usage Statistics

    DSpace software copyright © 2002-2015  DuraSpace
    Contact Us | Send Feedback
    Theme by 
    @mire NV