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dc.contributor.authorAider, Youssef
dc.contributor.authorSingh, Prashant
dc.date.accessioned2026-08-23T07:37:31Z
dc.date.available2026-08-23T07:37:31Z
dc.date.copyright2026/07/01
dc.date.issued2026
dc.identifier.issn1948-5085
dc.identifier.othertsea-25-1703.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4315367
dc.description.abstractAbstract. This study presents detailed endwall convective heat transfer measurements for four lattice topologies—pin fins, body-centered cubic (BCC), tetrakaidecahedron (TKD), and octet—arranged in inline configurations within a square duct. Each topology was tested in two configurations: continuous and discretely placed unit cells along the flow direction, resulting in a total of eight test articles. The transient liquid crystal thermography technique has been employed to determine the local convection heat transfer coefficient resulting from the sole contribution of fluid dynamics in lattice-based channels. The test articles were additively manufactured in a low thermal conductivity and low thermal diffusivity resin and installed in a duct (aspect ratio 1:1) representative of the mid-chord region of high-pressure turbine blades. Experiments were conducted for Reynolds numbers between 10,000 and 30,000. Heat transfer results are presented as normalized Nusselt number maps and spanwise-averaged profiles, revealing periodicity in the unit cell's thermal performance. TKD and octet topologies exhibited the highest convective heat transfer, while BCC demonstrated superior thermal-hydraulic performance. These results offer valuable benchmarks for computational studies using periodic boundary conditions in fluid-only domains.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDetailed Convective Heat Transfer at the Endwalls of Pin Fin, Body-Centered Cubic, Tetrakaidecahedron, and Octet Lattice-Based Cooling Channels
dc.typeJournal Paper
dc.journal.volume18
dc.journal.issue7
dc.journal.titleJournal of Thermal Science and Engineering Applications
dc.identifier.doi10.1115/1.4071500
dc.treeJournal of Thermal Science and Engineering Applications:;2026:;volume( 018 ):;issue:007
dc.contenttypeFulltext


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