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dc.contributor.authorShe, Pengcheng
dc.contributor.authorHe, Qiufu
dc.contributor.authorYang, Haoze
dc.contributor.authorGong, Jun
dc.contributor.authorYuan, Zuhao
dc.contributor.authorShi, Renping
dc.contributor.authorLi, Yong
dc.contributor.authorLi, Junhui
dc.date.accessioned2026-08-23T07:34:31Z
dc.date.available2026-08-23T07:34:31Z
dc.date.copyright2026/04/01
dc.date.issued2026
dc.identifier.issn1948-5085
dc.identifier.othertsea-25-1266.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4315296
dc.description.abstractAbstract. Temperature control of samples constitutes a critical aspect in magnetron sputtering processes. Poor surface temperature uniformity can lead to film warping and delamination, ultimately reducing chip production yield. Quartz lamp infrared matrix heating is a widely used method in magnetron sputtering heating systems due to its controllability and ease of adjustment. However, the temperature uniformity across the sample surface is highly sensitive to lamp arrangement, and improper layouts can result in significant temperature gradients. To improve temperature uniformity, we developed a finite element simulation model calibrated with experimental heating data. Based on this model, eight optimized lamp arrangements were designed and simulated. The results indicate that positioning lamps closer to the center enhances the heating rate in the central region and reduces temperature disparities across the sample. An optimal lamp layout was proposed based on simulations, and experimental validation confirmed a 30.27 °C reduction in temperature variation compared to the original setup, demonstrating that surface temperature uniformity is improved by 38%
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleOptimization of Temperature Field Uniformity in the Heating System of Magnetron Sputtering Equipment
dc.typeJournal Paper
dc.journal.volume18
dc.journal.issue4
dc.journal.titleJournal of Thermal Science and Engineering Applications
dc.identifier.doi10.1115/1.4070423
dc.journal.fristpage434
dc.journal.lastpage452
dc.page19
dc.treeJournal of Thermal Science and Engineering Applications:;2026:;volume( 018 ):;issue:004
dc.contenttypeFulltext


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