Materials Removal Mechanism in Laser-Assisted Machining SiCp/Al Composites

Abstract

Abstract. Silicon carbide particle-reinforced aluminum (SiCp/Al) metal matrix composites are widely employed in safety-critical areas, whereby their surface integrity is of high importance. Its machinability has been a significant challenge for industries to keep a desirable surface integrity, while laser-assisted machining (LAM) is a promising method to solve the problems. However, the material removal mechanism in LAM of SiCp/Al composite has not been fully revealed, especially the material reaction to the introduced laser thermal and chip formation, which restricts its further improvement in material removal rates and surface integrity. To fill in the gaps, the impact mechanisms of laser impact on the surface of silicon carbide–aluminum were investigated. Then, a self-designed cutting transient capture rig was designed to freeze the laser-assisted cutting process (quick-stop), which enables detailed studies of the thermally assisted phenomena, chip formation, and surface generation. New material removal mechanisms are revealed where only pull-out and push-in phenomena are found in laser-assisted scenarios, but conventional machining presents three kinds of conditions (pull-out, push-in, and particle break).