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dc.contributor.authorZhao, Zhengang
dc.contributor.authorZhu, Chenyu
dc.contributor.authorCai, Shuiyan
dc.contributor.authorLuo, Chuan
dc.date.accessioned2026-02-17T21:49:48Z
dc.date.available2026-02-17T21:49:48Z
dc.date.copyright3/11/2025 12:00:00 AM
dc.date.issued2025
dc.identifier.issn1948-5085
dc.identifier.othertsea-24-1403.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4310702
dc.description.abstractFlat-plate micro heat pipe (FMHP) plays an important role in the field of heat dissipation of electronic devices through vapor–liquid two-phase flow. Improving the heat transfer performance of FMHP has become a hot topic. This article analyzes the heat transfer principle of the FMHP to discover that balancing the capillary pressure and permeability of the wick is crucial to the heat transfer performance of the FMHP. Therefore, we propose a kind of copper powder and three kinds of copper powder-copper mesh integrated sintered wicks, build an experimental device, and analyze and research their heat transfer performance. The results show that the wick sintered from two layers of copper mesh and copper powder can better balance the capillary pressure and permeability, and the prepared FMHP has the best heat transfer performance. The maximum thermal power is 30 W and the minimum thermal resistance is 0.27 °C/W at the optimum filling ratios.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleHeat Transfer Performance of Copper Powder-Copper Mesh Composite Wick Flat-Plate Micro Heat Pipe
dc.typeJournal Paper
dc.journal.volume17
dc.journal.issue6
dc.journal.titleJournal of Thermal Science and Engineering Applications
dc.identifier.doi10.1115/1.4068024
dc.journal.fristpage61003-1
dc.journal.lastpage61003-8
dc.page8
dc.treeJournal of Thermal Science and Engineering Applications:;2025:;volume( 017 ):;issue: 006
dc.contenttypeFulltext


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