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Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm

dc.contributor.authorZhu, Miao
dc.contributor.authorYang, Xuexia
dc.contributor.authorSun, Yanxi
dc.contributor.authorLin, Jinbao
dc.contributor.authorLiu, Erqiang
dc.contributor.authorWang, Ze
dc.date.accessioned2026-02-17T21:35:40Z
dc.date.available2026-02-17T21:35:40Z
dc.date.copyright5/16/2025 12:00:00 AM
dc.date.issued2025
dc.identifier.issn1043-7398
dc.identifier.otherep_147_03_031005.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4310329
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleOptimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm
dc.typeJournal Paper
dc.journal.volume147
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4068450
dc.journal.fristpage31005-1
dc.journal.lastpage31005-9
dc.page9
dc.treeJournal of Electronic Packaging:;2025:;volume( 147 ):;issue: 003
dc.contenttypeFulltext


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