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dc.contributor.authorWan, Panpan
dc.contributor.authorZhang, Zhenghao
dc.contributor.authorHuang, Qishan
dc.contributor.authorZhou, Haofei
dc.date.accessioned2026-02-17T21:30:29Z
dc.date.available2026-02-17T21:30:29Z
dc.date.copyright9/10/2024 12:00:00 AM
dc.date.issued2024
dc.identifier.issn0021-8936
dc.identifier.otherjam_91_12_121001.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4310175
dc.description.abstractTriple junction (TJ) migration is a plastic deformation mechanism in polycrystalline metals mediated by the interplay between neighboring grain boundaries (GBs). Compared with GB migration, the dynamic change of TJ structure during migration and its impact on subsequent TJ behavior is often overlooked. In this study, we explore the effect of dynamic TJ structure evolution on TJ deformation mechanism in a face-centered cubic metal Au model using molecular dynamics simulations. Our analysis reveals that the dislocation accumulation at TJ due to inconsistent disconnection nucleation from neighboring GBs can influence the stick-slip behavior of TJ migration. With the dynamic change of TJ structure, the velocity of TJ migration is gradually reduced, leading to a transition from TJ migration to dislocation emission from TJ. We have developed an energetic model to evaluate the critical stresses required for TJ migration and dislocation emission, providing an explanation of the competition between TJ migration and dislocation emission. Our findings deepen the understanding of TJ-governed plastic deformation mechanisms in polycrystalline materials.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleRevealing the Effect of Dynamic Structural Evolution on Triple Junction Deformation Mechanism: Molecular Dynamics Simulations and an Energetic Model
dc.typeJournal Paper
dc.journal.volume91
dc.journal.issue12
dc.journal.titleJournal of Applied Mechanics
dc.identifier.doi10.1115/1.4066217
dc.journal.fristpage121001-1
dc.journal.lastpage121001-9
dc.page9
dc.treeJournal of Applied Mechanics:;2024:;volume( 091 ):;issue: 012
dc.contenttypeFulltext


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