Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits

dc.contributor.author	Lau, John H.
dc.date.accessioned	2025-04-21T10:35:45Z
dc.date.available	2025-04-21T10:35:45Z
dc.date.copyright	6/20/2024 12:00:00 AM
dc.date.issued	2024
dc.identifier.issn	1043-7398
dc.identifier.other	ep_147_01_011004.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl1/handle/yetl/4306516
dc.description.abstract	The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional (2D) and three-dimensional (3D) heterogeneous integration of application specific IC (ASIC) switch, PIC, and EIC w/o bridges, and heterogeneous integration of ASIC switch, PIC, and EIC on glass substrate will be discussed. Some recommendations will be provided.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
dc.type	Journal Paper
dc.journal.volume	147
dc.journal.issue	1
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4065667
dc.journal.fristpage	11004-1
dc.journal.lastpage	11004-12
dc.page	12
dc.tree	Journal of Electronic Packaging:;2024:;volume( 147 ):;issue: 001
dc.contenttype	Fulltext