| dc.description.abstract | With the development of electronic information technology, the integration and power of electronic equipment continue to increase. As an efficient heat transfer element, vapor chambers are widely used in the field of heat dissipation of electronic devices. However, greater challenges have been posed in terms of higher heat dissipation capacity, larger size, and lighter weight. Therefore, a large-scale aluminum vapor chamber with a size of 340 mm × 295 mm × 7.5 mm is designed for the heat dissipation of multi-point array heat sources. Multiple parallel porous ribs are sintered to form capillary wicking channels and vapor diffusion paths, which efficiently transfer the heat from the middle of the vapor chamber to the cold plate on the two sides. The transient working characteristics and heat dissipation performance under different working conditions are experimentally investigated. The results show that there is obvious temperature instability, which can be suppressed by the tilt of the vapor chamber and the increase of the heating power. Under the tilt condition, the temperature rises in the vertical direction due to the influence of gravity, while the inclination angle has basically no effect. The vapor chamber can work stably at the total heating power of 2100 W with the smallest thermal resistance 0.03 °C/W. The single-point heat flux can reach 7.3 W/cm2 for the 128 heat sources. Compared to a traditional vapor chamber, the proposed aluminum vapor chamber provides a thermal management solution for large-size electronic devices with multiple heat sources. | |
