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dc.contributor.authorRamakrishnan, Bharath
dc.contributor.authorTurner, Cam
dc.contributor.authorAlissa, Husam
dc.contributor.authorTrieu, Dennis
dc.contributor.authorRivera, Felipe
dc.contributor.authorMelton, Luke
dc.contributor.authorRao, Muralikrishna
dc.contributor.authorChigullapalli, Sruti
dc.contributor.authorGetachew, Tatek
dc.contributor.authorProdanovic, Vladimir
dc.contributor.authorLankston, Robert
dc.contributor.authorBelady, Christian
dc.contributor.authorOruganti, Vaidehi
dc.date.accessioned2025-04-21T10:22:45Z
dc.date.available2025-04-21T10:22:45Z
dc.date.copyright12/11/2024 12:00:00 AM
dc.date.issued2024
dc.identifier.issn1043-7398
dc.identifier.otherep_147_02_021003.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4306061
dc.description.abstractTraditionally, data centers (DC) have used air cooling for IT equipment, but as graphics processing units (GPUs) evolve, they demand more power and sophisticated cooling. Aiming for efficiency, direct liquid cooling (DLC) emerges as a promising solution. We evaluated the effectiveness of DLC versus traditional air cooling on a Microsoft G50 GPU server performing artificial intelligence/machine learning (AI/ML) tasks. The results indicated that DLC greatly enhances GPU performance, increases efficiency by 2.7% in Gflops/s, cuts power usage by 12%, reduces execution times by up to 6.22%, and lowers chip temperatures by 20 °C compared to air cooling. Our research develops an overall performance metric that considers data center, hardware, and chip levels, concluding that DLC is extremely beneficial for AI workloads, increasing energy savings and balancing performance with power requirements.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleUnderstanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
dc.typeJournal Paper
dc.journal.volume147
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4067136
dc.journal.fristpage21003-1
dc.journal.lastpage21003-10
dc.page10
dc.treeJournal of Electronic Packaging:;2024:;volume( 147 ):;issue: 002
dc.contenttypeFulltext


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