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dc.contributor.authorShishido, Nobuyuki
dc.contributor.authorHayama, Yutaka
dc.contributor.authorAkinaga, Yuki
dc.contributor.authorTaketomi, Shinya
dc.contributor.authorKoganemaru, Masaaki
dc.contributor.authorHagihara, Seiya
dc.contributor.authorMiyazaki, Noriyuki
dc.date.accessioned2025-04-21T10:16:37Z
dc.date.available2025-04-21T10:16:37Z
dc.date.copyright8/24/2024 12:00:00 AM
dc.date.issued2024
dc.identifier.issn1043-7398
dc.identifier.otherep_147_01_011010.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4305852
dc.description.abstractPower modules are utilized to control electric power and play a key role in the systems for energy conversion. One of the reliability problems in power modules is the wire-liftoff, in which an aluminum wire delaminates from a silicon chip. The wire-liftoff phenomenon is a thermal fatigue failure caused by repeated temperature cycles during the operation of power modules. According to an experimental study, the wire-liftoff lifetime decreases with increase in the maximum junction temperature of a temperature cycle, Tmax, then levels off above 200 °C of Tmax. Such a saturation phenomenon of the wire-liftoff lifetime is main concern of the present study. We select the nonlinear fracture mechanics parameter T*-integral range, as a physical quantity describing the wire-liftoff lifetime. The T*-integral range, ΔT*, is only one fracture mechanics parameter that can be applied to thermal fatigue under a cyclic thermo-elastic-plastic creep condition. We perform nonlinear finite element analyses of a power module to calculate the ΔT* based on the mathematical expression of ΔT* for various temperature cycles. As a result, the ΔT* obtained from the exact method based on the mathematical expression of ΔT* is expected to be utilized for quantitative estimation of wire-liftoff lifetime in a wide temperature range of low to high temperatures.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleApplication of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
dc.typeJournal Paper
dc.journal.volume147
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4066100
dc.journal.fristpage11010-1
dc.journal.lastpage11010-9
dc.page9
dc.treeJournal of Electronic Packaging:;2024:;volume( 147 ):;issue: 001
dc.contenttypeFulltext


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