Hyperspectral Analysis of Silicon Nanowires Manufactured Through Metal-Assisted Chemical Etching

Abstract

This study used hyperspectral imaging to analyze localized near-field interactions between incident electromagnetic waves and silicon nanowire (SiNW) arrays manufactured through catalytic etching of Si wafers for different durations. The results revealed that the unetched upper surface area on Si wafers and reflection of incident light decreased with increasing etching time. A light reflection band peaking at approximately 880 nm was generated from arrays etched for more than 1 h. We used six separate hyperspectral images to analyze the wavelength-dependent spatial optical responses of the fabricated SiNW arrays. The images revealed hot spots of light reflection from unetched Si surfaces in the wavelength range of 470–750 nm and a resonant peak at 880 nm for a photonic crystal derived from a random SiNW array. Accordingly, hyperspectral imaging enables the assessment of localized optical responses of SiNW arrays, which can then be optimized to cater to various applications.