Special Issue: Highlights of CIE 2023

dc.date.accessioned	2024-12-24T19:02:53Z
dc.date.available	2024-12-24T19:02:53Z
dc.date.copyright	4/25/2024 12:00:00 AM
dc.date.issued	2024
dc.identifier.issn	1530-9827
dc.identifier.other	jcise_24_5_050301.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl1/handle/yetl/4303197
dc.description.abstract	This special issue contains a selection of 14 manuscripts (two technical briefs and 12 research papers) from the 43nd American Society of Mechanical Engineers (ASME) Computers and Information in Engineering (CIE) Conference that was held in Boston, MA, August 20–23, 2023, in conjunction with the International Design Engineering Technical Conferences (IDETCs). Nominated by the four technical committees, namely, Advanced Modeling and Simulation (AMS), Computer Aided Product and Process Development (CAPPD), Systems Engineering, Information and Knowledge Management (SEIKM), and Virtual Environments and Systems (VES) based on the conference paper review results, these papers reflect recent and relevant advancements in these technical areas.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Special Issue: Highlights of CIE 2023
dc.type	Journal Paper
dc.journal.volume	24
dc.journal.issue	5
dc.journal.title	Journal of Computing and Information Science in Engineering
dc.identifier.doi	10.1115/1.4065345
dc.journal.fristpage	50301-1
dc.journal.lastpage	50301-1
dc.page	1
dc.tree	Journal of Computing and Information Science in Engineering:;2024:;volume( 024 ):;issue: 005
dc.contenttype	Fulltext