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dc.contributor.authorO'Connor, Nathaniel
dc.contributor.authorTalmor, Michal
dc.contributor.authorYagoobi, Jamal
dc.date.accessioned2024-12-24T18:57:11Z
dc.date.available2024-12-24T18:57:11Z
dc.date.copyright1/29/2024 12:00:00 AM
dc.date.issued2024
dc.identifier.issn2832-8450
dc.identifier.otherht_146_04_041601.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4303037
dc.description.abstractFlow boiling in mini and microchannels has become an attractive option for many applications, such as compact and low-charge heat exchangers. Microchannel heat exchangers, however, are more susceptible to maldistribution between parallel flow channels. When operating during uneven heat load conditions, the maldistribution becomes even more severe. Electrohydrodynamic (EHD) conduction pumping technology offers an innovative way to redistribute flow between parallel branches in a microchannel heat exchanger and is also being explored as a next-generation mechanism of microgravity heat transport. In EHD conduction pumping, a strong electric field interacts with dissociated electrolytes in dielectric fluid to generate a net body force, and thus, a net flow, with no moving parts, no acoustical noise, lower power consumption, and the ability to operate in microgravity. An EHD conduction pump was designed, fabricated, and tested for upstream flow distribution control of a parallel microchannel evaporator in an opposing configuration. Flow redistribution capability was measured at system flowrates up to 6 ml/min. The EHD conduction pump was capable of completely blocking and reversing the flow in its branch. Recovery from near-critical heat flux conditions up to a maximum heat flux of 77.5 W/cm2 was also demonstrated for the operating conditions and design of this study. This was achieved in the absence of enhanced surfaces. The working fluid is HFE 7100. The results show that EHD conduction is able to effectively control the flow distribution of the microchannel evaporator, however, its effectiveness decreases with increasing heat flux and flowrate.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleUpstream Electrohydrodynamic Conduction Pumping for Flow Distribution Control of Parallel Microchannel Evaporators
dc.typeJournal Paper
dc.journal.volume146
dc.journal.issue4
dc.journal.titleASME Journal of Heat and Mass Transfer
dc.identifier.doi10.1115/1.4064442
dc.journal.fristpage41601-1
dc.journal.lastpage41601-10
dc.page10
dc.treeASME Journal of Heat and Mass Transfer:;2024:;volume( 146 ):;issue: 004
dc.contenttypeFulltext


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