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dc.contributor.authorLohan, Danny J.
dc.contributor.authorDede, Ercan M.
dc.contributor.authorSchmalenberg, Paul
dc.date.accessioned2024-12-24T18:54:26Z
dc.date.available2024-12-24T18:54:26Z
dc.date.copyright7/25/2024 12:00:00 AM
dc.date.issued2024
dc.identifier.issn2770-3495
dc.identifier.otheraoje_3_031021.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302961
dc.description.abstractNext generation sensor systems for automated vehicle navigation are likely to include light detection and ranging (LiDAR) sensors. Solid-state LiDAR technology that eliminates all mechanically moving parts is expected to enable compact and highly reliable operation. A challenge for such solid-state sensors is the thermal load generated by the on-chip light source, or laser, which includes power dissipated in the form of heat from additional integrated circuit components that are part of the full optoelectronics package. Here, we review possible thermal management strategies for a representative solid-state LiDAR package and focus on a programable scanning and beam intensity control technique for the sensor to enhance the thermal performance of the integrated light source. We demonstrate the impact of the proposed optimized beam scanning method in realizing a ~20% reduction in the device maximum temperature rise for the representative LiDAR sensor optoelectronics package when using a simplified forced air cooling solution. The method may be utilized for practical thermal management of sensors in a range of land-based navigational applications for automated vehicles or robotics.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleSolid-State LiDAR With Optimized Dynamic Beam Power Intensity for Reduced Thermal Load
dc.typeJournal Paper
dc.journal.volume3
dc.journal.titleASME Open Journal of Engineering
dc.identifier.doi10.1115/1.4065898
dc.journal.fristpage31021-1
dc.journal.lastpage31021-8
dc.page8
dc.treeASME Open Journal of Engineering:;2024:;volume( 003 ):;issue: 00
dc.contenttypeFulltext


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