| dc.description.abstract | Thermal and hydraulic performances of seven water-cooled minichannel cold plates with different internal structures are compared using numerical analysis. Recent increasing demands for high-performance computing have led to serious challenges in the thermal management of electronic devices. In addition to dangerous on-chip temperatures, heterogeneous integration and local regions of elevated temperatures (hotspots) lead to nonuniform chip-level temperature distributions. As a result, the lifespan and reliability of electronic devices are adversely impacted. Due to the limitation of the air-cooled heat sinks, several new methods, such as liquid-cooled microchannel cold plates are developed to remedy these challenges. The objective of this work is to provide a comparative numerical study of the effectiveness of different minichannel cold plate internal structures in the thermal management of a chip with a nonuniform power map and a hotspot. Cold plate thermal resistance, on-chip temperature uniformity, and pump power were the metrics used for this comparison. For four coolant inlet flow rates within the laminar regime, it is seen that increasing the inlet flowrate enhances the thermal resistance of all cold plate designs while creating less uniformity in chip-level temperature distribution relative to the conventional straight microchannels. Concentrating pin fins on the hotspot showed a 7.2% reduction in thermal resistance, despite increasing temperature nonuniformity by about 7.6%. However, it is observed that hotspot-focused pin fins are more effective in lowering the chip's maximum temperature. Obtaining lower chip-level nonuniformity may be possible by modifying the inlet and outlet conditions of the cold plates. | |
