Experimental Study on Interface Thermal Resistance of Heat Dissipation Channel in Low-Temperature Detector

Abstract

To achieve a good heat dissipation effect in the heat dissipation channel of the low-temperature detector, it is necessary to study the thermal conductivity performance of GD414C and indium foil between detector and thermal conductive aluminum block. Based on the experimental principle and referring to the ASTM D-5470 testing method, a set of interface thermal resistance experimental testing equipment is designed. The experiment comparatively studies the relationship between the temperature difference between detector and thermal conductive aluminum block (TCAB) under different power and thermal conductive fillers. The experimental results show that when GD414C is filled between detector and thermal conductive aluminum block, the total thermal resistance is 0.728 ℃/W. When 0.1-mm-thick indium foil is filled, the total thermal resistance is 0.235 ℃/W. When 0.2-mm-thick indium foil is filled, the total thermal resistance is 0.123 ℃/W. Therefore, 0.2-mm-thick indium foil should be selected as the thermal conductive filler.