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dc.contributor.authorKalita, Sanjib
dc.contributor.authorSen, Pulak
dc.contributor.authorSen, Dipak
dc.contributor.authorDas, Sudev
dc.contributor.authorSaha, Bidyut Baran
dc.date.accessioned2024-12-24T18:42:22Z
dc.date.available2024-12-24T18:42:22Z
dc.date.copyright5/10/2024 12:00:00 AM
dc.date.issued2024
dc.identifier.issn1948-5085
dc.identifier.othertsea_16_7_071007.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302596
dc.description.abstractOwing to their exceptionally high thermal conductivity, there is a growing demand for graphene nanoparticles in phase transition heat transfer applications. This research delves into the exploration of various critical phenomena within the realm of surface science, specifically focusing on interactions at solid-liquid and liquid-liquid interfaces. In this work, graphene nanoparticles at varying concentrations are subject to electrochemical deposition on a microporous copper substrate to form graphene coated over microporous copper (GCOMC). The study encompasses a comprehensive analysis of surface characteristics, such as porosity, roughness, and wettability. Furthermore, the study involves the calculation of two key heat transfer metrics, the critical heat flux (CHF) and the boiling heat transfer coefficient (BHTC), through the execution of pool boiling experiments. The findings of this research underscore the remarkable superiority of GCOMC surfaces over their uncoated copper counterparts in terms of boiling performance. Particularly, the GCOMC surface showcases an impressive 87.5% enhancement in CHF and a 233% increase in BHTC compared to the bare copper surface. Furthermore, this investigation delves into a detailed quantitative analysis of bubble behavior, encompassing parameters such as bubble departure diameter, bubble departure frequency, and nucleation site density, employing high-speed camera techniques to comprehensively understand the underlying processes.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titlePhase Transition Heat Transfer Enhancement of a Graphene-Coated Microporous Copper Surface Using Two-Step Electrodeposition Method
dc.typeJournal Paper
dc.journal.volume16
dc.journal.issue7
dc.journal.titleJournal of Thermal Science and Engineering Applications
dc.identifier.doi10.1115/1.4065358
dc.journal.fristpage71007-1
dc.journal.lastpage71007-14
dc.page14
dc.treeJournal of Thermal Science and Engineering Applications:;2024:;volume( 016 ):;issue: 007
dc.contenttypeFulltext


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