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dc.contributor.authorLiu, Yang
dc.contributor.authorYan, Zhe
dc.contributor.authorJiang, Zhenhua
dc.contributor.authorLi, Nanxi
dc.contributor.authorYang, Baoyu
dc.contributor.authorWu, Yinong
dc.date.accessioned2024-12-24T18:40:59Z
dc.date.available2024-12-24T18:40:59Z
dc.date.copyright11/16/2023 12:00:00 AM
dc.date.issued2023
dc.identifier.issn1948-5085
dc.identifier.othertsea_16_2_021006.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302555
dc.description.abstractThis study experimentally investigates the small two-phase thermosyphon loop with a minichannel evaporator. The influences of heating power, fan power, and inclination angle on the heat transfer performance are presented, and the related mechanisms are revealed. Results show that the thermal resistance of the thermosyphon loop tends to decrease as the heating power is increased. It is found that there exists an optimal value of fan power. Interestingly, the invalidity behavior of thermosyphon under the inclination condition prefers to occur at higher heating power. To sum up, the small two-phase thermosyphon loop with a minichannel evaporator could produce excellent heat transfer performance with energy-saving characteristics, indicating its wide potential applications in the field of electronic chip cooling.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleExperimental Study on the Small Two-Phase Thermosyphon Loop With Minichannel Evaporator
dc.typeJournal Paper
dc.journal.volume16
dc.journal.issue2
dc.journal.titleJournal of Thermal Science and Engineering Applications
dc.identifier.doi10.1115/1.4063913
dc.journal.fristpage21006-1
dc.journal.lastpage21006-8
dc.page8
dc.treeJournal of Thermal Science and Engineering Applications:;2023:;volume( 016 ):;issue: 002
dc.contenttypeFulltext


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