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    Effects of Periodically Changing Temperatures on the Bond Interface between Crack Sealant and Repaired Pavement

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    10.1061-JPEODX.PVENG-1248.pdf (6.382Mb)
    Date
    2024/03/01
    Author
    Shaoquan Wang
    Yingsong Li
    Ziyao Wei
    Ying Gao
    Yanshun Jia
    Manyu Liu
    Zugang Zhang
    Zhangwen Ou
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    Abstract
    To study the influence of periodically changing temperature on the crack repair structure of asphalt pavement, the temperature field model and temperature stress calculation model of repaired pavement structure with crack sealant were established using ABAQUS. The temperature field distributions in different climate divisions were obtained. The mechanical response of bond interface between crack sealant and repaired pavement was calculated. The results indicate that the bond interface is subjected to tensile and shear stress under periodically changing temperature. The most unfavorable positions of tensile and shear stress were determined. The tensile stress level is much higher than shear stress in five climate divisions. The stress level of bond interface is significantly influenced by the lowest temperature and temperature difference. The different pavement structure forms have a slight effect on the stress level of the bond interface, but this effect is far less than the influence of climate conditions. Finally, the bond failure of bond interface was simulated. Based on the simulation, the minimum bonding strength requirements (Tn) for crack sealant in different climate divisions were proposed. These requirements provide a reference and basis for the bonding performance evaluation and practical application of crack sealant.
    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4296655
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