Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)

dc.contributor.author	Cheng, Hsien-Chie
dc.contributor.author	Liu, Yan-Cheng
dc.date.accessioned	2024-04-24T22:21:58Z
dc.date.available	2024-04-24T22:21:58Z
dc.date.copyright	10/5/2023 12:00:00 AM
dc.date.issued	2023
dc.identifier.issn	1043-7398
dc.identifier.other	ep_146_01_017002.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl1/handle/yetl/4295081
dc.description.abstract	An error occurred in the school affiliation address of the authors. Taichung, Taiwan 407, China is incorrect. It should be Taichung, Taiwan 407.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)
dc.type	Journal Paper
dc.journal.volume	146
dc.journal.issue	1
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4063546
dc.journal.fristpage	17002-1
dc.journal.lastpage	17002-1
dc.page	1
dc.tree	Journal of Electronic Packaging:;2023:;volume( 146 ):;issue: 001
dc.contenttype	Fulltext