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dc.contributor.authorParet, Paul
dc.contributor.authorFinegan, Donal
dc.contributor.authorNarumanchi, Sreekant
dc.date.accessioned2023-11-29T18:33:32Z
dc.date.available2023-11-29T18:33:32Z
dc.date.copyright12/9/2022 12:00:00 AM
dc.date.issued12/9/2022 12:00:00 AM
dc.date.issued2022-12-09
dc.identifier.issn1043-7398
dc.identifier.otherep_145_03_034501.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4294221
dc.description.abstractProgress in the field of power electronics within electric vehicles has generally been driven by conventional engineering design principles and experiential learning. Power electronics is inherently a multidomain field where semiconductor physics and electrical, thermal, and mechanical design knowledge converge to achieve a practical realization of desired targets in the form of conversion efficiency, power density, and reliability. Due to the promising nature of artificial intelligence in delivering rapid results, engineers are starting to explore the ways in which it can contribute to making power electronics more compact and reliable. Here, we conduct a brief review of the foray of artificial intelligence in three distinct subtechnologies within a power electronics system in the context of electric vehicles: semiconductor devices, power electronics module design and prognostics, and thermal management design. The intent is not to report an exhaustive literature review, but to identify the state of the art and opportunities for artificial intelligence to play a meaningful role in power electronics design from a mechanical and thermal standpoint, as well as to discuss a few promising future research directions.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleArtificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
dc.typeJournal Paper
dc.journal.volume145
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4056306
dc.journal.fristpage34501-1
dc.journal.lastpage34501-7
dc.page7
dc.treeJournal of Electronic Packaging:;2022:;volume( 145 ):;issue: 003
dc.contenttypeFulltext


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