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dc.contributor.authorZhang, Chunyun
dc.contributor.authorHe, Zheng
dc.contributor.authorLv, Jun
dc.contributor.authorLiu, Kun
dc.contributor.authorCui, Miao
dc.date.accessioned2023-08-16T18:27:38Z
dc.date.available2023-08-16T18:27:38Z
dc.date.copyright4/21/2023 12:00:00 AM
dc.date.issued2023
dc.identifier.issn2832-8450
dc.identifier.otherht_145_08_084501.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4291993
dc.description.abstractMultilayer materials have been widely used in engineering applications, attributed to excellent thermo-mechanical performances. However, the thermal or mechanical properties of multilayer materials remain elusive, owing to contact behaviors etc. factors. In order to address this issue, an innovative method is employed to estimate the effective thermal conductivity (ETC) of multilayer materials considering thermal contact resistance (TCR) between layers, and the equivalence performance is investigated by solving three-dimensional inverse heat conduction problems. First, the equivalence method is validated by available experimental data of a multilayered insulation composite material. Then, the precision of different equivalence methods is compared, and the results indicate that the anisotropic equivalence method has higher accuracy than the isotropic and orthotropic equivalences for the five-layer material in the present work. Finally, the robustness and stability of the anisotropic equivalence method are evaluated in detail. The present work provides a new alternative method for predicting the effective thermal conductivity of multilayer materials.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleInverse Estimation of Effective Thermal Conductivity of Multilayer Materials Considering Thermal Contact Resistance
dc.typeJournal Paper
dc.journal.volume145
dc.journal.issue8
dc.journal.titleASME Journal of Heat and Mass Transfer
dc.identifier.doi10.1115/1.4062306
dc.journal.fristpage84501-1
dc.journal.lastpage84501-6
dc.page6
dc.treeASME Journal of Heat and Mass Transfer:;2023:;volume( 145 ):;issue: 008
dc.contenttypeFulltext


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