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dc.contributor.authorKaur, Inderjot
dc.contributor.authorMujahid, Shiraz
dc.contributor.authorPaudel, YubRaj
dc.contributor.authorRhee, Hongjoo
dc.contributor.authorSingh, Prashant
dc.date.accessioned2023-08-16T18:15:06Z
dc.date.available2023-08-16T18:15:06Z
dc.date.copyright12/21/2022 12:00:00 AM
dc.date.issued2022
dc.identifier.issn1043-7398
dc.identifier.otherep_145_03_031002.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4291708
dc.description.abstractSingle unit cell thick lattice frame materials have applications in efficient heat exchangers. This study is focused on strut-based sandwich-type configurations obtained through reticulation of unit cell topologies of tetrakaidecahedron (TKD), octet, and rhombic dodecahedron (DDC) shapes at a porosity of 0.9 with water as the working fluid. Interfacial heat transfer coefficient values on struts and endwalls were determined by imposing constant temperature boundary condition. Averaged heat transfer coefficient on the endwall was the highest for tetrakaidecahedron lattice whereas rhombic dodecahedron lattice exhibited the highest average interfacial heat transfer coefficients on the struts. Flow analysis showed the presence of strong secondary flow features on planes normal to the mean flow direction that demonstrated the unique flow mixing capabilities of these lattices. Reported interfacial heat transfer coefficient at struts and endwall can be used in volume-averaged computations of metal foams (representative of lattices' flow and thermal properties) under local thermal nonequilibrium.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleNumerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
dc.typeJournal Paper
dc.journal.volume145
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4056305
dc.journal.fristpage31002-1
dc.journal.lastpage31002-9
dc.page9
dc.treeJournal of Electronic Packaging:;2022:;volume( 145 ):;issue: 003
dc.contenttypeFulltext


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