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dc.contributor.authorKhanbolouki, Pouria;Tehrani, Mehran
dc.date.accessioned2023-04-06T12:49:47Z
dc.date.available2023-04-06T12:49:47Z
dc.date.copyright6/2/2022 12:00:00 AM
dc.date.issued2022
dc.identifier.issn221481
dc.identifier.otherht_144_08_082901.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4288587
dc.description.abstractAn enabling advantage of carbonbased conductors is their low density and high thermal conductivity. To put this in the perspective of applications, current rating of carbonbased and copper nanocomposite conductors of different lengths are modeled. For comparison, the current and current density required to raise the maximum temperature of studied conductors to 150 °C are calculated with a joule heating model. The model is validated with an experimental setup equipped with a thermal camera. It is shown that while doped carbon nanotube (CNT) conductors may potentially result in improved performance compared with copper on a weight basis, ultraconductive copper (UCC) can outperform copper on both volume and weight bases. Additionally, a hypothetical coppermatrix composite conductor with different volume fractions of high thermal conductivity and lightweight graphene fibers (Cu–C composite) is included in the analysis. The properties of the Cu–C composite are evaluated based on the Lewis–Nielson and rule of mixture models, as inputs for the joule heating model. The results show that while the improved thermal conductivity of the composite is beneficial for improving the current rating in microelectronics applications, the tradeoff for the decreased electrical conductivity results in lower current carrying capacity in applications that use longer conductors.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleModeling Ampacity in Advanced Electrical Conductors
dc.typeJournal Paper
dc.journal.volume144
dc.journal.issue8
dc.journal.titleJournal of Heat Transfer
dc.identifier.doi10.1115/1.4054552
dc.journal.fristpage82901
dc.journal.lastpage829019
dc.page9
dc.treeJournal of Heat Transfer:;2022:;volume( 144 ):;issue: 008
dc.contenttypeFulltext


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