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dc.contributor.authorSchuler, Louis
dc.contributor.authorChamoin, Ludovic
dc.contributor.authorKhatir, Zoubir
dc.contributor.authorBerkani, Mounira
dc.contributor.authorOuhab, Merouane
dc.contributor.authorDegrenne, Nicolas
dc.date.accessioned2022-05-08T09:06:37Z
dc.date.available2022-05-08T09:06:37Z
dc.date.copyright3/7/2022 12:00:00 AM
dc.date.issued2022
dc.identifier.issn1043-7398
dc.identifier.otherep_144_03_031013.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4284740
dc.description.abstractA reduced weakly-coupled thermo-mechanical model based on the proper generalized decomposition method was developed for the numerical analysis of power modules. The employed model reduction method enabled us to obtain, in a preliminary offline phase, the solution of the thermo-mechanical problem over a large range of design parameters, with much time saving compared to a classical (brute force) multi-resolution finite element method. In an online postprocessing phase, the power module lifetime, modeled with a strain-life law, was then computed in a straightforward manner by rapidly evaluating the solution for any value of the parameters. Sensitivity analysis was conducted to select parameters values leading to acceptable module lifetimes with respect to given criteria. A robust design study was also performed to illustrate the performance of the proposed approach.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleA Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
dc.typeJournal Paper
dc.journal.volume144
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4053767
dc.journal.fristpage31013-1
dc.journal.lastpage31013-10
dc.page10
dc.treeJournal of Electronic Packaging:;2022:;volume( 144 ):;issue: 003
dc.contenttypeFulltext


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