| dc.date.accessioned | 2022-02-06T05:27:37Z | |
| dc.date.available | 2022-02-06T05:27:37Z | |
| dc.date.copyright | 10/1/2021 12:00:00 AM | |
| dc.date.issued | 2021 | |
| dc.identifier.issn | 1043-7398 | |
| dc.identifier.other | ep_143_04_048001.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4278072 | |
| dc.description.abstract | This prestigious society-wide medal will memorialize Avi's legacy and impact on our community. Medal recipients must not only exhibit excellence in electronics, photonics, mechanics, and packaging phenomena but also exhibit visionary leadership and widespread mentorship of the next generation, following Avi's example.A $75,000 endowment must be raised to establish the medal. Please join the community in making a personally meaningful contribution as a way to recognize Avi's impact in establishing our field and in motivating generations of engineers and scientists. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal | |
| dc.type | Journal Paper | |
| dc.journal.volume | 143 | |
| dc.journal.issue | 4 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4052403 | |
| dc.journal.fristpage | 048001-1 | |
| dc.journal.lastpage | 048001-1 | |
| dc.page | 1 | |
| dc.tree | Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 004 | |
| dc.contenttype | Fulltext | |
