Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Abstract

This Special Section of the ASME Journal of Electronic Packaging (JEP) is dedicated to state-of-the-art advancements made in nanoscale and microscale thermal energy transport across a variety of electronics cooling platforms. This topic has quickly emerged as a central issue in electronics packaging, particulary as device length scales approach the mean free path of heat energy carriers and traditional cooling techniques achieve maximum cooling effectiveness. Further, the nanoscale and microscale regimes present unique challenges to dissipating heat from electronics because the physics of energy transport transitions from those described by continuum mechanics to physics that require insight into the way in which quantized microscopic energy carriers traverse within solids and fluids.