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dc.contributor.authorLiu, Yang
dc.contributor.authorLi, Zhao
dc.contributor.authorZhou, Min
dc.contributor.authorZeng, Xianghua
dc.contributor.authorSun, Fenglian
dc.date.accessioned2022-02-05T22:13:32Z
dc.date.available2022-02-05T22:13:32Z
dc.date.copyright1/19/2021 12:00:00 AM
dc.date.issued2021
dc.identifier.issn1043-7398
dc.identifier.otherep_143_03_031002.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4277158
dc.description.abstractCu foam (Cu-F) and Ag-coated Cu-F were added into nano-Ag paste to obtain Cu-F@nano-Ag composite sintered joint. The microstructure, hardness, and shear behavior of the sintered joints were investigated. Experimental results indicated that the addition of Cu-F and Ag-coated Cu-F suppressed the generation and propagation of cracks at the interface of the sintered joint. As the thickness of the Cu-F increased from 0.1 mm to 0.2 mm, the deformation ratio of the Cu-F sheet raised from 12% to 50%. Thereby, the hardness and bonding strength of the sintered joint was improved due to the microstructural densification. The bonding quality between Cu-F and sintered Ag is enhanced by the Ag-coating treatment. Therefore, the Ag-coated composite joints show higher shear strength than the others.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleEffect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
dc.typeJournal Paper
dc.journal.volume143
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4049128
dc.journal.fristpage031002-1
dc.journal.lastpage031002-7
dc.page7
dc.treeJournal of Electronic Packaging:;2021:;volume( 143 ):;issue: 003
dc.contenttypeFulltext


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