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dc.contributor.authorKasukurthy, Rajesh
dc.contributor.authorRachakonda, Amruthavalli
dc.contributor.authorAgonafer, Dereje
dc.date.accessioned2022-02-05T22:13:29Z
dc.date.available2022-02-05T22:13:29Z
dc.date.copyright1/19/2021 12:00:00 AM
dc.date.issued2021
dc.identifier.issn1043-7398
dc.identifier.otherep_143_03_031001.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4277157
dc.description.abstractData centers are a large group of networked servers used by organizations for computational and storage purposes. In 2014, data centers consumed an estimated 70 billion kWh in the United States alone. It is incumbent on thermal engineers to develop efficient methods in order to minimize the expenditure at least toward cooling considering the limited available power resources. One of the key areas where electronic cooling research has been focusing, is addressing the issue of nonuniform power distribution at the rack, server and even at package levels. Nonuniform heating at the chip level creates hotspots and temperature gradients across the chip which in turn significantly increases the cost of cooling, as cooling cost is a function of the maximum junction temperature. This challenge has increased the use of temperature sensing mechanisms to help in finding ways to mitigate the gradients. A very effective way to conserve pumping power and address hotspots on the single or multichip modules is by targeted delivery of liquid coolant. One way to enable such targeted delivery of coolant is by using dynamic cold plates coupled with self-regulating flow control device that can control flow rate based on temperature. This novel technology will have more effective implementation coupled with a good control strategy. This paper addresses the development and testing of such control strategy with minimal sensors along with less latency and optimization of the same.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDesign and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling
dc.typeJournal Paper
dc.journal.volume143
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4049018
dc.journal.fristpage031001-1
dc.journal.lastpage031001-5
dc.page5
dc.treeJournal of Electronic Packaging:;2021:;volume( 143 ):;issue: 003
dc.contenttypeFulltext


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