Special Issue on InterPACK 2019 – Part 1

Abstract

We hope that you find the content of the Special Issues useful and wish you the very best.The two-part 2019 InterPACK Special Issues of the ASME Journal of Electronic Packaging (JEP) was developed from manuscripts submitted by authors of technical papers and presentations in response to the open solicitation following the conference. All submitted manuscripts were subject to an independent peer-review process in accordance with the editorial standards of the ASME JEP. The accepted articles cover all the topics that are mentioned in the prior paragraph. It is expected that this collection of papers will serve as a high quality, informative resource for EPPD members, as well as the broader research and engineering community. We would like to sincerely thank all the authors who contributed to the Special Issues, and the reviewers who provided critical feedback to enhance the quality of the final manuscripts. Thanks also to former JEP Editor Professor Y. C. Lee and Assistant Jeffery Lo for their support in this endeavor.