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dc.contributor.authorIradukunda, Ange-Christian
dc.contributor.authorKasitz, Josh
dc.contributor.authorCarlton, Hayden
dc.contributor.authorHuitink, David
dc.contributor.authorDeshpande, Amol
dc.contributor.authorLuo, Fang
dc.date.accessioned2022-02-04T14:34:35Z
dc.date.available2022-02-04T14:34:35Z
dc.date.copyright2020/05/04/
dc.date.issued2020
dc.identifier.issn1043-7398
dc.identifier.otherep_142_03_031109.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4273944
dc.description.abstractRapid temperature transients sustained during the operation of high-voltage electronics can be difficult to manage by relying solely on uniform heat removal mechanisms. Phase-change materials (PCMs) can be useful as a buffer against these intermittent temperature spikes when integrated into electronic packages. However, their integration poses challenges of both physical and electrical interactions within the package, particularly in high-voltage systems. This study aims to evaluate electrical and thermal properties of nano-enhanced PCMs to inform their integration in high-voltage systems. The nanocomposites are obtained by seeding 3 × 10−5 and 3 × 10−4 wt % of gold and iron oxide particles to sorbitol. Improvements in thermal properties including thermal conductivity as high as 8% are observed; however, this comes at the expense of the dielectric strength of the PCM. Additionally, an implementation scheme for the nano-enhanced PCMs in a high-voltage-capable power module is proposed with accompanying computational and experimental performance data.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleConcurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
dc.typeJournal Paper
dc.journal.volume142
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4046935
dc.page31109
dc.treeJournal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
dc.contenttypeFulltext


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